January 21, 2021

Radient Technologies Announces close of subsequent tranche of Private Placement and Shares for Debt arrangements

EDMONTON, Alberta, January  21, 2021 Radient Technologies Inc. (“Radient” or the “Company”) (TSX Venture: RTI; OTCQX: RDDTF), a manufacturer of high-quality cannabinoid based formulations and products, announces that it has closed a subsequent tranche of its previously announced non-brokered private placement (the “Offering”).